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... soldering paste – in particular with lead-free soldering paste – depends greatly on the soldering procedure, such as convection ovens with or without a | CIRCUIT BOARDS | nitrogen atmosphere, high cooker ovens, etc Tests so far show that bonding is not as good as with the other named surfaces. Therefore, the self-centralising | CIRCUIT BOARDS | effect is noticeably lower and requires greater precision of solder paste pressure. In addition, the test for soldering ability showed that emphasis should be placed | CIRCUIT BOARDS | on a suitable flux agent, as this, in addition to the thermic effect, also leads to the removal of the OSP layer. In Europe, there | CIRCUIT BOARDS | is a lack of enthusiasm for OSP, especially due to the great demands made on the flexibility of lead-free surfaces, plus the need for multi- | CIRCUIT BOARDS | soldering using a variety of thermic processes with standard flux agents. DIFFERENT INDUSTRIAL STRUCTURES – DIFFERENT SURFACES It is, therefore, not surprising that, especially in | CIRCUIT BOARDS | Asia, OSP is as popular as chemical tin is in Europe, or chemical ...
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... If not otherwise stipulated, the PCB contour will be determined by the centre (=centre vector) of the contour lines provided in the order data. | CIRCUIT BOARDS | If Slots are represented by you by rectangular outlines, then we assume generally that the corner radius is contained. | 13. TECHNICAL SPECIFICATIONS | PRINTED | CIRCUIT BOARDS | CIRCUIT BOARDS | 13.1 For further technical specifications of our manufacturing processes, please refer to our Process & Capability Manual in the "Standard" category. These | CIRCUIT BOARDS | standard technical criteria also apply even if your manufacturing data and documents call for other features (special technical requirements are available in our Premium Jet | CIRCUIT BOARDS | Line). | 14. UL CERTIFICATION | 14.1 If the PCB is to be produced in line with our UL Certification, please follow the layout instructions.. | CIRCUIT BOARDS | | 15. INNERLAYERS | 15.1 The minimum spacing of not plated through holes/plated through holes not surrounded by a pad to innerlayer copper must be | CIRCUIT BOARDS | at least 400 µ. The minimum spacing of the innerlayer ...
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... PCB`s should be stored in heated and dry rooms. Constant low humidity is necessary before the soldering processes start. A rapid fall in temperature | CIRCUIT BOARDS | of more than 7 degrees causes condensation on the stored PCB`s. Humidity should never exceed 65 %. The package must be kept intact although the | CIRCUIT BOARDS | polyethylene packages capability of keeping humidity away is not really reliable. C STORAGE TIME The storage time of PCB`s should be as short as possible. | CIRCUIT BOARDS | PCB`s should be taken out due to the „first-in, first out“ rule. The the polyethylene packages should be taken away just before the assembling. Remaining | CIRCUIT BOARDS | PCB`s should be repacked again. To avoid exposure to draught, the packages should be stored in boxes. D SOLDERING TESTS PCB`s stored for over several | CIRCUIT BOARDS | months and being transported under questionable conditions, should be submitted again to a soldering test, being equivalent to your soldering process. E HEAT CONDITIONING OF | CIRCUIT BOARDS | THE PCB`S In any case we suggest a drying process of the PCB`s in ...
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